Android 機板
RK900 機板 (Rockchip RK3399主板)
產品說明
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產品
Application: Android 7.1 ---21.5” AIO
規格說明
Main Board / PCBA only
specification:
CPU: ARM Platform: Rockchip RK3399 CPU
GPU: Mali-T864
PMU / PMIC: RK808 –power management
RAM: 2G DDRIII RAM or 4G DDRIII RAM
Flash: 16GB EMMC 5.1
OS: Android 7.1.2
Interface:
USB 2.0 wafer: 4 x USB 2.0 internal / HOST
USB 2.0 wafer: For USB camera
USB 2.0 wafer: For TP
Ethernet: 1 x RJ 45 10/100/1000 (Giga interface)
WiFi: 802.11 b/g/n and 802.11ac
BT: BT4.1 , BLE
Audio Out: 1x Audio output
NFC connector: FPC connector -reserve
Power Button: Wafer
UART: 1 x UART for debug /develop
IR connector: wafer
LVDS 2-chanel: LVDS for 21.5”
上盈通訊股份有限公司為台灣的專業Android機板(Rockchip主板)製造商，已經研發製造多款Android主機板，並使用Rockchip瑞芯微晶片客製機板，包含Rockchip RK3399晶片, Rockchip RK3288晶片, Rockchip RK3328晶片, Rockchip RK3128晶片, Rockchip PX30晶片, Rockchip RK3368晶片, Rockchip RK3188晶片，並提供客戶Rockchip軟硬體客製一站式服務。
specification:
CPU: ARM Platform: Rockchip RK3399 CPU
GPU: Mali-T864
PMU / PMIC: RK808 –power management
RAM: 2G DDRIII RAM or 4G DDRIII RAM
Flash: 16GB EMMC 5.1
OS: Android 7.1.2
Interface:
USB 2.0 wafer: 4 x USB 2.0 internal / HOST
USB 2.0 wafer: For USB camera
USB 2.0 wafer: For TP
Ethernet: 1 x RJ 45 10/100/1000 (Giga interface)
WiFi: 802.11 b/g/n and 802.11ac
BT: BT4.1 , BLE
Audio Out: 1x Audio output
NFC connector: FPC connector -reserve
Power Button: Wafer
UART: 1 x UART for debug /develop
IR connector: wafer
LVDS 2-chanel: LVDS for 21.5”
上盈通訊股份有限公司為台灣的專業Android機板(Rockchip主板)製造商，已經研發製造多款Android主機板，並使用Rockchip瑞芯微晶片客製機板，包含Rockchip RK3399晶片, Rockchip RK3288晶片, Rockchip RK3328晶片, Rockchip RK3128晶片, Rockchip PX30晶片, Rockchip RK3368晶片, Rockchip RK3188晶片，並提供客戶Rockchip軟硬體客製一站式服務。
