Android 機板
TK960M 機板 (Rockchip RK3288主板)
產品說明
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OS: Android 5.1 / 6.0
規格說明
Main Board / PCBA only
specification:
CPU: ARM Platform: Rockchip RK3288 CPU
GPU: Mali-T764
PMU / PMIC: RK818 –power management
RAM: 2G DDRIII RAM
Flash: 8GB EMMC 5.1
OS: Android 5.1 / 6.0, 2018-Q3 Android 7.1 and 8.0
Interface:
USB 2.0 wafer: For usb camera
USB 2.0 wafer
USB 2.0 wafer: For TP
USB OTG
Micro SD Slot
HDMI output: Dual Display
Ethernet: 1 x RJ 45 10/100/1000 (Giga interface)
WiFi: 802.11 b/g/n
Bluetooth: BT4.1 , BLE
Audio Out: 3.5mm
Speaker: Wafer for left and wafer for right speaker (3watt)
NFC connector: FPC connector -reserve
Power: DC Jack, 12V 5A
UART: 1 x UART for debug /develop
LVDS 2-chanel: LVDS for 21.5”
Backlight: For 21.5inch
eDP: eDP for 13.3inch or 15.6inch panel
上盈通訊股份有限公司為優良的Rockchip瑞芯微電子台灣方案商，提供Rockchip解決方案，是台灣新竹科學園區專業的Rockchip主機板製造商，現金已推出多款使用Rockchip瑞芯微晶片的Android主機板。
上盈通訊股份有限公司提供瑞芯微Rockchip晶片軟硬體客製化專案服務，包含瑞芯微Rockchip RK3399晶片、瑞芯微Rockchip RK3288晶片、瑞芯微Rockchip RK3328晶片、瑞芯微Rockchip RK3128晶片、瑞芯微Rockchip PX30晶片、瑞芯微Rockchip RK3368晶片、瑞芯微Rockchip RK3188晶片…等。
specification:
CPU: ARM Platform: Rockchip RK3288 CPU
GPU: Mali-T764
PMU / PMIC: RK818 –power management
RAM: 2G DDRIII RAM
Flash: 8GB EMMC 5.1
OS: Android 5.1 / 6.0, 2018-Q3 Android 7.1 and 8.0
Interface:
USB 2.0 wafer: For usb camera
USB 2.0 wafer
USB 2.0 wafer: For TP
USB OTG
Micro SD Slot
HDMI output: Dual Display
Ethernet: 1 x RJ 45 10/100/1000 (Giga interface)
WiFi: 802.11 b/g/n
Bluetooth: BT4.1 , BLE
Audio Out: 3.5mm
Speaker: Wafer for left and wafer for right speaker (3watt)
NFC connector: FPC connector -reserve
Power: DC Jack, 12V 5A
UART: 1 x UART for debug /develop
LVDS 2-chanel: LVDS for 21.5”
Backlight: For 21.5inch
eDP: eDP for 13.3inch or 15.6inch panel
上盈通訊股份有限公司為優良的Rockchip瑞芯微電子台灣方案商，提供Rockchip解決方案，是台灣新竹科學園區專業的Rockchip主機板製造商，現金已推出多款使用Rockchip瑞芯微晶片的Android主機板。
上盈通訊股份有限公司提供瑞芯微Rockchip晶片軟硬體客製化專案服務，包含瑞芯微Rockchip RK3399晶片、瑞芯微Rockchip RK3288晶片、瑞芯微Rockchip RK3328晶片、瑞芯微Rockchip RK3128晶片、瑞芯微Rockchip PX30晶片、瑞芯微Rockchip RK3368晶片、瑞芯微Rockchip RK3188晶片…等。
